Optoelectronics

Laird Thermal Systems Announces New Line of Micro Thermoelectric Coolers for Next Generation Optoelectronic Packages


November 12, 2024 - Laird Thermal Systems launches the OptoTEC™ MBX Series, a new line of micro thermoelectric coolers for high-performance space-constrained optoelectronic applications. Leveraging next-generation thermoelectric materials and advanced process automation, the MBX Series offers innovative configurations designed for integration into TO-Can, TOSA, and Butterfly packages.




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Eco-Friendly Temperature Stabilization Solutions for OEMs’ Climate Action Goals

Introduction

At Laird Thermal Systems, we are committed to eco-friendly solutions for temperature stabilization for demanding applications across global medical, analytical, industrial, transportation, and telecommunications markets.

Older compressor-based systems often use high global-warming potential (GWP) HFC refrigerants like R134a and R404A. New industry requirements are moving away from the use of such refrigerants due to their environmental impact. New government restrictions on traditional and natural refrigerants are central to compressor-based systems.

Multistage Micro Thermoelectric Coolers for Miniature Optical Image Sensing Applications

Introduction

Miniature optical packages provide a robust hermetic seal to protect small image-sensing components, including CMOS, CCD, IR, and X-ray detectors. Optical packages, like Transistor Outline (TO) Cans, are widely used for image-sensing applications. For high-end image sensing, micro thermoelectric coolers (TECs) can be integrated into optical packages called Optical Thermoelectric Assemblies (TEAs). This will provide deep cooling to temperatures well below ambient to minimize thermal noise and capture maximum light spectrum.

OptoTEC™ MSX Series

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OptoTEC™ MBX Series

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Cooling Solutions for Autonomous Systems


Advances in autonomous technologies, such as smart headlights, autonomous systems for collision avoidance, and infotainment systems, require enhanced thermal protection of critical electronics to ensure optimized performance. These emerging intelligent autonomous systems are increasingly complex while decreasing in size and weight. Packing more functionality into smaller footprints has increased the heat flux density and thermal challenges in autonomous systems.