CP10-71-05-L1-W4.5
MFG Part Number 44440-501
Ceramic Plate Series Thermoelectric Cooler
The CP10-71-05-L1-W4.5 is a high-performance and highly reliable standard Thermoelectric Cooler. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics. It has a maximum Qc of 18.5 Watts when ΔT = 0 and a maximum ΔT of 70.5 °C at Qc = 0.

You can interact with the Performance Curves below to estimate the cooling performance by entering the thermal and electrical operating conditions for your application.
Click the [Custom Datasheet] button to create a Customized PDF Datasheet.
Please Note: Actual application performance will vary from calculated values based on actual thermal design characteristics.


Electrical and Thermal Performance

For maximum performance, be sure to orient the CONTROL side of the TEC against the application to be managed and the AMBIENT side against the heat sink or other heat rejection method. The CONTROL side is always opposite the side with lead attachments. Lead attachment is a passive heat loss and less impactful if located on the side that attaches to the heat exchanger.

Use the sliders, input fields and [UPDATE] button below to enter your application's electrical and thermal conditions. Use the Graph Y and X Axis buttons to display a variety of performance curves and use the Voltage/Current slider to choose the electrical operating point to display performance.
Click the [Custom Datasheet] button to save your results as a Customized PDF Datasheet.


Select Graph
Y - Axis




Select Graph
X - Axis


Optimum COP
Cooling Power (Qc) = 1.89 Watts
Current = 0.45 Amps
Voltage = 1.1 Volts
Power Supply = 0.49 Watts
COP (Qc/Pin) = 3.83
Power Dissipated (Qh) = 2.39 Watts
Maximum Qc
Cooling Power (Qc) = 16.47 Watts
Current = 4.43 Amps
Voltage = 8.42 Volts
Power Supply = 37.31 Watts
COP (Qc/Pin) = 0.44
Power Dissipated (Qh) = 53.78 Watts

Electrical Operating Point
Imin: 0.2 A
Imax: 4.4 A

Vmin: 0.6 V
Vmax: 8.4 V
Voltage

Current
Cooling Power (Qc)

Power Supply (Pin)

COP (Qc/Pin)

Power Dissipated (Qh)

TEC Cold Temperature at Control (Tc)

TEC Hot Temperature at Ambient (Th)

Thermal Operating Conditions
 Cooling 
 Heating  
Ambient High Temperature
Control Temperature
Ambient Low Temperature
Cooling ΔT
Heating ΔT
Ambient Side
Thermal Resistance  
Control Side
Thermal Resistance  
Click to UPDATE performance after changing thermal operating conditions or switching between heating and cooling mode.

Specifications
Hot Side Temperature
27.0 °C
35.0 °C
50.0 °C
Qcmax (ΔT = 0)
18.5 Watts
19.0 Watts
20.0 Watts
ΔTmax (Qc = 0)
70.5°C
73.5°C
78.8°C
Imax (I @ ΔTmax)
4.0 Amps
4.0 Amps
3.9 Amps
Vmax (V @ ΔTmax)
7.8 Volts
8.1 Volts
8.6 Volts
Module Resistance
1.81 Ohms
1.88 Ohms
2.03 Ohms
Max Operating Temperature
80 °C
 
 
Weight
6.0 gram(s)
 
 

Finishing Options
Suffix
Thickness
Flatness / Parallelism
Hot Face
Cold Face
Lead Length
 L1
3.300 ±0.025 mm
0.130 ± 0.0010 in
0.025 mm / 0.025 mm
0.001 in / 0.001 in
Lapped
Lapped
114.3 mm
4.50 in
Sealing Options
Suffix
Sealant
Color
Temp Range
Description
 
None
No sealing specified
Notes
  1.  Max operating temperature: 80°C
  2.  Do not exceed Imax or Vmax when operating module
  3.  Reference assembly guidelines for recommended installation
  4.  Solder tinning also available on metallized ceramics

Any information furnished by Laird and its agents, whether in specifications, data sheets, product catalogues or otherwise, is believed to be (but is not warranted as being) accurate and reliable, is provided for information only and does not form part of any contract with Laird. All specifications are subject to change without notice. Laird assumes no responsibility and disclaims all liability for losses or damages resulting from use of or reliance on this information. All Laird products are sold subject to the Laird Terms and Conditions of sale (including Laird’s limited warranty) in effect from time to time, a copy of which will be furnished upon request.

© Copyright 2019-2024 Laird Thermal Systems, Inc. All rights reserved. Laird™, the Laird Ring Logo, and Laird Thermal Systems™ are trademarks or registered trademarks of Laird Limited or its subsidiaries.

Revision: 00 Date: 06-01-2022

Print Date: 11-02-2024