The OTX19-35-F1N-0612-11-W2.25 is a high-performance, miniature thermoelectric cooler. The OTX19-35-F1N-0612-11-W2.25 is primarily used in applications to stabilize the temperature of sensitive optical components in the telecom and photonics industries. It has a maximum Qc of 4.7 Watts when ΔT = 0 and a maximum ΔT of 72.9 °C at Qc = 0.
- Miniature footprint
- Precise temperature control
- Reliable solid-state operation
- No sound or vibration
- RoHS-compliant
You can interact with the Performance Curves below to estimate the cooling performance
by entering the thermal and electrical operating conditions for your application.
Click the [Custom Datasheet] button to create a Customized PDF Datasheet.
Please Note: Actual application performance will vary from calculated values based on actual thermal design characteristics.
For maximum performance, be sure to orient the CONTROL side of the TEC against the application to be managed and the AMBIENT side against the heat sink or other heat rejection method. The CONTROL side is always opposite the side with lead attachments. Lead attachment is a passive heat loss and less impactful if located on the side that attaches to the heat exchanger.
Use the sliders, input fields and [UPDATE]
button below to enter your application's electrical and thermal conditions.
Use the Graph Y and X Axis buttons to display a variety of performance curves and use the
Voltage/Current slider to choose the electrical operating point to display performance.
Click the [Custom Datasheet] button to save your results as a Customized PDF Datasheet.
Select Graph
Y - Axis
Select Graph
X - Axis
Cooling Power (Qc) = 0.46 Watts
Current = 0.21 Amps
Voltage = 0.55 Volts
Power Supply = 0.11 Watts
COP (Qc/Pin) = 4.03
Power Dissipated (Qh) = 0.57 Watts
Cooling Power (Qc) = 4.22 Watts
Current = 2.14 Amps
Voltage = 4.43 Volts
Power Supply = 9.5 Watts
COP (Qc/Pin) = 0.44
Power Dissipated (Qh) = 13.71 Watts
0.065 ± 0.0050 in
0.002 in / 0.002 in
2.00 in
- Max operating temperature: 120°C
- Do not exceed Imax or Vmax when operating module
- Reference assembly guidelines for recommended installation
- Solder tinning also available on metallized ceramics
Any information furnished by Laird and its agents,
whether in specifications, data sheets, product catalogues or otherwise,
is believed to be (but is not warranted as being) accurate and reliable,
is provided for information only and does not form part of any contract with Laird.
All specifications are subject to change without notice.
Laird assumes no responsibility and disclaims all liability for losses or damages resulting from use
of or reliance on this information. All Laird products are sold subject to the Laird Terms and Conditions of sale
(including Laird’s limited warranty)
in effect from time to time, a copy of which will be furnished upon request.
© Copyright 2019-2024 Laird Thermal Systems, Inc.
All rights reserved. Laird™, the Laird Ring Logo, and Laird Thermal Systems™ are trademarks or registered
trademarks of Laird Limited or its subsidiaries.
OptoTEC™ is a trademark of Laird Thermal Systems, Inc. All other marks are owned by their respective owners.
Revision: 00 Date: 06-01-2022
Print Date: 12-22-2024
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Contact Tech Support
Sales and Support Centers
Asia/Pacific: +86 755 3698 8333 x218
Americas: +1 919-597-7300
EMEA (DE): +49 8031 6192887
EMEA (SE): +46 31 7046757
EMEA (CZ) +420 488 575 111